The **ATS-07A-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "pushPIN™" series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 40.00mm x 25.00mm | | **Thermal Resistance (Unducted)** | 7.14 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 0.81 °C/W @ 100 LFM | | **Fin Type** | Fine-Pitch (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the characteristics of the heat sink: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Series Number (pushPIN™ Heat Sink). * **A:** Material/Attachment variation. * **20:** Specific model geometry. * **C2:** Material/Color code (typically signifies AL6063 with Blue Anodized finish). * **R0:** Revision/Packaging indicator. --- ### 3. Key Electronic/Physical Components While it does not contain silicon or circuitry, it is comprised of several critical "parts" that work together to protect electronics: #### A. The Heat Sink Body * **Design:** Features a high-performance cross-cut fin pattern. This increases the surface area for heat dissipation and allows for omnidirectional airflow, making it effective in various mounting orientations. * **Composition:** Made of Aluminum 6063 for a balance between thermal conductivity, weight, and corrosion resistance. #### B. The pushPIN™ Attachment * **Mechanism:** Uses a brass or plastic pin with a stainless steel spring. * **Benefit:** Provides a precise and consistent pressure (load) on the electronic component, ensuring optimal contact with the heat source while preventing damage to the PCB. #### C. Thermal Interface Material (TIM) * **T766:** This part comes with a pre-applied phase-change or high-performance thermal pad. This fills the microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 4. Typical Applications This part is commonly used to cool: * **Processors (CPUs/GPUs):** Small to mid-range embedded processors. * **FPGAs & ASICs:** High-speed logic gates that generate localized heat. * **Power Modules:** Transistors and power converters that require stable thermal environments to prevent "thermal runaway."