The **ATS-07A-62-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.48°C/W (Unducted Flow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design #### A. The Heat Sink Body (Passive Cooling) The body is constructed from high-grade aluminum. It uses a **Straight Fin** geometry. In electronics, the surface area is critical; the fins increase the area available for heat to transfer from the solid component to the surrounding air. #### B. Push-Pin Mounting Mechanism Unlike adhesive-based heat sinks, the "62" series uses a mechanical push-pin system: * **Internal Spring:** Provides consistent downward pressure (clamping force) to ensure maximum contact between the chip and the heat sink. * **Reliability:** Mechanical mounting is preferred in high-vibration environments compared to thermal tape. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates the inclusion of **T766** thermal phase-change material. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip. * **Performance:** T766 provides low thermal impedance, ensuring efficient heat conduction as soon as the device powers on. --- ### 3. Application Use Cases This part is commonly found in the following electronic systems: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial motherboards where vertical space (15mm) is limited. 3. **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ### 4. Thermal Performance Data Thermal resistance depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.48 | | 300 (1.5 m/s) | 6.67 | | 500 (2.5 m/s) | 4.73 |