The **ATS-07A-94-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 1.62°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of Components #### A. The Heat Sink Body * **Material:** Made from high-grade aluminum for a balance between weight, cost, and thermal conductivity. * **Geometry:** It features a square footprint (40mm) and a height of 25mm. The vertical fins increase the surface area, allowing air to carry heat away from the base more efficiently. * **Blue Anodizing:** This chemical treatment increases corrosion resistance and provides a slight improvement in radiative heat transfer. #### B. The Attachment Mechanism (Push-Pins) * **Brass Push-Pins:** These provide a secure, standardized method for mounting the heat sink to a Printed Circuit Board (PCB). * **Compression Springs:** These ensure constant pressure is applied to the component below, which is critical for maintaining a stable thermal contact. #### C. Thermal Interface Material (TIM) * **T766:** This part comes with **T766** pre-applied to the base. The TIM fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance at the contact point. --- ### 3. Application Use Cases The ATS-07A-94-C2-R0 is typically used in environments where **forced air cooling** (fans) is present. Common applications include: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial Power Supplies:** Dissipating heat from MOSFETs or IGBTs. * **Embedded Computing:** Standard cooling for single-board computers (SBCs).