The **ATS-07D-209-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and PCB components. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics as detailed in the table below: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 70.00 mm x 70.00 mm | | **Height** | 10.00 mm | | **Pitch (Hole spacing)** | 63.00 mm | | **Thermal Resistance** | 6.33 °C/W (Unducted Flow @ 1.0 m/s) | | **Thermal Interface Material** | T412 (Phase change material) | --- ## 2. Key Features and Components ### A. The Heat Sink Body The device utilizes a **Straight Fin** design. The low profile (10mm height) makes it ideal for applications with limited vertical clearance, such as 1U rack servers or thin industrial computers. ### B. Push-Pin Attachment Instead of using adhesive tapes or screw-and-nut assemblies, this part uses the **pushPIN™** system: * **Compression Springs:** Provide precise pressure to ensure maximum contact between the heat sink and the component. * **Brass/Plastic Pins:** Ensure the heat sink remains securely fastened under mechanical shock or vibration. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**. This is a thermal pad or phase-change material that fills microscopic air gaps between the heat sink and the electronic component (CPU, FPGA, or GPU), significantly reducing thermal resistance. --- ## 3. Performance Data Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (m/s) | Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 0.5 m/s | 100 | 10.83 °C/W | | 1.0 m/s | 200 | 6.33 °C/W | | 2.5 m/s | 500 | 3.52 °C/W | --- ## 4. Typical Applications This component is commonly found in: * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PC motherboards. * **Power Electronics:** Cooling MOSFETs or power conversion modules.