The **ATS-07E-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Here are the key technical details for this model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Style** | Straight (High-Flow design) | | **Thermal Resistance** | 3.95°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Core Electronic Components The "parts" of this assembly include several integrated components that work together to secure the cooling solution: ### A. The Heat Sink Body Constructed from high-grade aluminum. The 30mm height and straight-fin pattern are optimized for **forced air cooling** (environments with fans). The blue anodized coating increases surface emissivity and protects the aluminum from corrosion. ### B. pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical "pushPIN" system. This consists of: * **Flexible Springs:** Provide precise pressure (compression) to ensure the heat sink remains in constant contact with the chip. * **Plastic/Brass Pins:** Insert into pre-drilled holes on the PCB to lock the unit in place. ### C. Thermal Interface Material (TIM) The base of the unit comes pre-applied with **T766**. This is a phase-change or grease-like material that fills microscopic air gaps between the electronic component (the heat source) and the heat sink base, significantly improving heat transfer efficiency. --- ## 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 3.95 | | **400 (2.0 m/s)** | 1.90 | | **600 (3.0 m/s)** | 1.50 | --- ## 4. Typical Applications * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators.