The **ATS-07F-01-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 21.90°C/W @ Natural Convection | | **Dimensions (L x W x H)** | 40mm x 40mm x 6mm | | **Fin Style** | Straight (Square) | | **Thermal Interface Material (TIM)** | No TIM (Requires thermal paste/pad) | --- ### 2. Key Design Components #### A. The Heat Sink Body The "01" in the part number indicates the specific height (6mm), which is a **low-profile** design. This makes it ideal for compact electronic enclosures where vertical space is limited. The blue anodized finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. #### B. The Push Pin Mounting System The **ATS-07** series utilizes a spring-loaded push pin mechanism. This offers several electronic and mechanical advantages: * **Constant Pressure:** The springs ensure uniform pressure across the component surface, which optimizes the thermal interface. * **Secure Fit:** It provides a more secure mechanical connection than adhesive tapes, especially in high-vibration environments. * **Pre-drilled Holes:** This component requires specific holes in the PCB (Printed Circuit Board) for installation. #### C. Fin Geometry The fins are designed to increase the surface area of the metal. Since this model has a low height (6mm), it relies heavily on **forced air** (fan cooling) to be effective, as there is less surface area for natural convection compared to taller sinks. --- ### 3. Application Use Cases This electronic part is typically found in: * **Embedded Systems:** Industrial PCs and small form factor controllers. * **Telecommunications:** Cooling chipsets on routers and switches. * **Power Electronics:** Small MOSFET arrays or voltage regulators that require moderate heat dissipation. ---