The **ATS-07F-83-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **heat sink** designed for cooling electronic integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the key characteristics of this component: | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 1.58°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 30mm | | **Fin Pattern** | Cross-Cut (Square Pin Fin) | --- ### 2. Design and Construction The design of the ATS-07F-83-C1-R0 is optimized for airflow efficiency and thermal dissipation: * **Cross-Cut Fin Design:** Unlike straight-fin heat sinks, the square pin-fin pattern allows for omnidirectional airflow. This is critical in cramped electronic enclosures where air may not flow in a single straight line. * **Material:** It is made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides increased surface emissivity and protects the aluminum from corrosion. --- ### 3. Mounting System (pushPIN™) One of the defining features of this part is the **pushPIN™** attachment mechanism: 1. **Ease of Assembly:** It uses a spring-loaded pin that snaps into pre-drilled holes on the PCB. 2. **Contact Pressure:** The spring ensures consistent pressure between the heat sink and the electronic component, which is vital for optimal heat transfer. 3. **Interface Material:** These units typically come with **Thermal Interface Material (TIM)** pre-applied to the base (usually a high-performance phase-change material or thermal tape). --- ### 4. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the silicon. For the **ATS-07F-83-C1-R0**: * **At 200 LFM (Linear Feet per Minute):** 1.58°C/W. * **At 500 LFM:** Approximately 0.95°C/W. *Note: Lower °C/W values indicate better cooling performance.*