The **ATS-07G-142-C3-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as CPUs, GPUs, and high-power chipsets. Below is a detailed breakdown of its technical specifications and features. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Thermal Resistance** | 10.22 °C/W @ 100 LFM (Airflow) | | **Weight** | ~30 grams | --- ### 2. Key Design Components #### A. Fin Geometry (Straight Fin) The "G" in the part number indicates a **Straight Fin** design. This is optimized for environments where there is a consistent, directional airflow. The gaps between the fins allow air to pass through and carry heat away from the base via convection. #### B. Thermal Interface Material (TIM) The **"C3"** designation in the part number refers to the specific Thermal Interface Material pre-applied to the base. - **T412:** A high-performance thermal pad or grease is usually applied to ensure there are no air gaps between the heat sink and the electronic component, maximizing heat transfer. #### C. pushPIN™ Attachment System This part uses a spring-loaded push-pin mechanism. - **Efficiency:** Provides precise pressure (load) to the component to improve thermal contact. - **Reliability:** The springs maintain constant tension even under thermal expansion or vibration. - **Ease of Use:** Allows for quick installation without complex tools. --- ### 3. Thermal Performance Profile Thermal resistance determines how effectively the heat sink dissipates heat. For the ATS-07G-142-C3-R0, performance varies based on air velocity: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.22 | | 300 (1.5 m/s) | 5.07 | | 500 (2.5 m/s) | 3.90 | | 700 (3.5 m/s) | 3.32 | --- ### 4. Electronic Compatibility This heat sink is typically used for: * **BGA (Ball Grid Array) Packages:** Protecting integrated circuits from overheating. * **Power Modules:** Voltage regulators or MOSFETs that generate significant heat in a small 30x30mm footprint. * **Embedded Systems:** Industrial PCs or networking hardware where space is limited but thermal management is critical. ---