The **ATS-07G-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Series** | pushPIN™ | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 17.58°C/W (at 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### 2. Design and Components The ATS-07G-33-C3-R0 is engineered for specific airflow environments and mechanical stability: * **Push-Pin Attachment:** It utilizes the "pushPIN™" system, which uses a spring-loaded pin to provide a precise amount of pressure (preload) on the component. This ensures optimal thermal contact while preventing damage to the PCB. * **Straight Fin Geometry:** The vertical fins are designed to allow air to pass through in a linear fashion, making it highly effective in forced-air cooling systems (e.g., inside a chassis with fans). * **Pre-Applied Thermal Interface Material (TIM):** Most parts in this series come with a high-performance thermal pad or grease pre-applied to the base, reducing installation time and ensuring heat transfer efficiency. --- ### 3. Application Use Cases This heatsink is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** For industrial PCs where heat dissipation is critical in confined spaces. 3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs) or LED drivers. --- ### 4. Thermal Performance Overview Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.58 | | 300 (1.5 m/s) | 6.17 | | 500 (2.5 m/s) | 4.30 |