The **ATS-07G-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07G-41-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | ~10.02° C/W (at 1.0 m/s airflow) | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Design Features #### A. pushPIN™ Attachment System This part features a specialized mounting mechanism. Unlike adhesive tapes, it uses a flexible **pushPIN™** system which provides: * **Constant Pressure:** Ensures a tight interface between the heatsink and the component for optimal heat transfer. * **Pre-drilled Holes:** Designed for specific PCB layouts to ensure secure attachment during high-vibration environments. #### B. Material and Coating * **Aluminum Construction:** Offers a balance of lightweight properties and high thermal conductivity. * **Blue Anodized Finish:** Not only provides aesthetic appeal but also increases surface emissivity and protects the aluminum from corrosion and electrical shorting risk. #### C. Thermal Interface Material (TIM) The "C3" in the part number typically indicates that the heatsink comes with a **pre-applied Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a uniform layer that reduces the air gaps between the heat source and the heatsink. --- ### 3. Usage Context This part is typically used in industrial or enterprise electronics where air cooling (convection) is present. It is sized for mid-to-large integrated circuits (ICs) and is common in: 1. **Networking equipment** (switches and routers). 2. **Embedded computing boards**. 3. **Power supplies** requiring passive or active airflow cooling. ---