The **ATS-07G-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure stability and longevity. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.10°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 25mm | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Specific series or design iteration. * **G**: Represents the length/width dimensions (35mm x 35mm). * **52**: Represents the height (25mm). * **C3**: Indicates the Thermal Interface Material (TIM) and color/finish (typically a high-performance T766 phase-change material). * **R0**: Revision or packaging indicator. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it has no electrical components), its role in an electronic circuit is critical: * **Heat Dissipation:** It increases the surface area of the heat-generating component, allowing air to carry away excess thermal energy via convection. * **Thermal Interface Material (TIM):** The "C3" designation suggests it comes pre-applied with a thermal pad or paste, which fills microscopic air gaps between the component and the heat sink to maximize heat transfer. * **Mechanical Stability:** The use of a **Push-Pin** mechanism ensures a precise and consistent pressure is applied to the chip, which is vital for maintaining thermal contact without cracking the silicon die. --- ### 4. Mounting & Application This part is commonly used on **PCBs (Printed Circuit Boards)** where standard mounting holes are available. ```yaml Application_Type: Mid-range power electronics Mounting_Type: Push-pin with Brass/Plastic Spring Airflow_Requirement: Active (Fan-driven) or Passive (Natural convection) Recommended_Use: BGA, FPGA, and Power Converters ```