The **ATS-07G-61-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Series** | pushPIN™ HS | | **Fin Type** | Cross-Cut (Square/Rectangular pins) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 21.97°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components. | Dimension | Measurement (mm) | | :--- | :--- | | **Length (Width)** | 40.00 mm | | **Width (Depth)** | 40.00 mm | | **Height** | 10.00 mm | | **Pin Pitch (Spacing)** | 45.00 mm | --- ### 3. Key Electronic Components & Features #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this model uses a **pushPIN™** mechanism. This consists of: * **Brass/Plastic Pins:** Used to secure the sink to pre-drilled holes in the PCB. * **Compression Springs:** These provide a precise "force-to-chip" ratio, ensuring optimal contact between the heat sink base and the electronic component without cracking the die. #### B. Cross-Cut Fin Design The "G" in the part number denotes the fin pattern. Cross-cut fins allow for **multi-directional airflow**. This is vital in dense electronic enclosures where air may not flow in a single linear path. #### C. Thermal Interface Material (TIM) The **"R0"** suffix typically indicates that the part comes with a pre-applied high-performance Thermal Interface Material. This eliminates the need for manual application of thermal paste and ensures low thermal impedance between the silicon and the aluminum. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (measured in Linear Feet per Minute - LFM): * **Unducted Flow (100 LFM):** 21.97 °C/W * **Unducted Flow (400 LFM):** 5.78 °C/W * **Unducted Flow (700 LFM):** 3.96 °C/W ---