The **ATS-07G-87-C3-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the key technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 14.91°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | | **Fin Style** | Straight (Cross-cut) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal properties: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **07**: Series designation (Push-pin heat sinks). 3. **G**: Hole pattern/Mounting distance code. 4. **87**: Unique design identifier (dimensions and fin configuration). 5. **C3**: Color and material code (typically signifies Blue Anodized Aluminum). 6. **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it is vital for the electronic health of a system: * **Thermal Dissipation:** It increases the surface area of the heat-generating component, allowing air to carry away heat more efficiently. * **Thermal Interface:** It comes with **T412**, a phase-change thermal interface material. This fills microscopic air gaps between the chip and the heat sink, ensuring maximum heat transfer. * **Mechanical Protection:** The push-pin mechanism provides a consistent "clamping force," ensuring that the heat sink remains in contact with the chip even under mechanical vibration or thermal expansion. --- ### 4. Mounting Diagram Logic The push-pin system requires specific PCB drilling. The general layout is as follows: ```text [PCB Surface] | | <------- Plastic Push-Pin +--|--|--+ | H S | <---- Heat Sink (35mm x 35mm) +--|--|--+ | | <------- Compression Spring +--------+ | CHIP | <---- Electronic Component (IC) +--------+ | PCB | <---- Pre-drilled Holes +--------+ ```