The **ATS-07H-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number provides specific details about its dimensions, material, and thermal performance. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Flowing)** | 7.21 °C/W (@100 LFM) to 2.12 °C/W (@700 LFM) | | **Thermal Interface Material (TIM)** | T412 (High-performance thermal tape/pad) | --- ## 2. Key Components & Design The "electronic parts" of this assembly aren't active circuits, but rather mechanical-thermal interfaces designed for electronic integration: ### A. The Heat Sink Body * **Fin Design:** It utilizes a **Square Pin Fin** pattern. Unlike straight fins, pin fins allow for multidirectional airflow, making it ideal for systems where the direction of the cooling fan's exhaust might vary. * **Material:** Made of lightweight aluminum, which offers a balance between cost-effectiveness and high thermal conductivity. ### B. The Attachment Mechanism (Push-Pins) * The unit uses a **Push-Pin** system with a compression spring. * This provides consistent pressure across the component surface, ensuring the Thermal Interface Material (TIM) fills all microscopic gaps between the heat sink and the chip. ### C. Thermal Interface Material (TIM) * The "C3" in the part number indicates a specific thermal compound or tape (T412) pre-applied to the base. * This material acts as the "bridge" that conducts heat from the electronic chip into the aluminum fins. --- ## 3. Performance Breakdown The effectiveness of this part depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Static/Low Air) | 7.21 | | 400 (Moderate Air) | 2.62 | | 700 (High Performance) | 2.12 | --- ## 4. Typical Applications This specific heat sink is commonly found in: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Industrial PCs:** Compact systems where vertical space is limited to 15mm. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators.