ATS-08A-71-C2-R0
AI

The **ATS-08A-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 19.50° C/W (at 100 LFM) to 3.20° C/W (at 700 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Fin Style** | Straight Fin |
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### 2. Physical Design Features
The "electronic" profile of this part is centered around airflow optimization and mechanical stability:
* **Straight Fin Design:** This model utilizes longitudinal fins, which are ideal for systems with clear, unidirectional airflow.
* **pushPIN™ Attachment:** Unlike adhesive tapes, the push-pin mechanism provides a secure mechanical connection to the PCB. This ensures constant pressure (7-10 lbs) on the electronic component, improving thermal transfer through the interface material.
* **Low Profile:** With a height of only 10mm, it is suitable for dense electronic assemblies or thin enclosures where vertical space is limited.
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### 3. Thermal Performance Data
Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (Unducted) |
| :--- | :--- |
| 100 | 19.50 °C/W |
| 300 | 5.30 °C/W |
| 500 | 3.80 °C/W |
| 700 | 3.20 °C/W |
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### 4. Part Number Breakdown
The suffix `C2` indicates the specific Thermal Interface Material (TIM) and color:
* **C2:** Refers to a Blue Anodized finish and a specific thermal grease or pad type pre-applied to the base.
* **R0:** This is the revision/packaging code for the product series.
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What is the difference between straight fin and cross-cut fin heat sinks in this series?
- ⤷ How do I calculate the correct push-pin size for my PCB thickness?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?