The **ATS-08B-159-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. This specific part is designed for the thermal management of electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08B-159-C2-R0 | | **Heat Sink Type** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | XC-CUT (Cross-Cut) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Features and Design #### A. Fin Design (XC-CUT) The "XC-CUT" or cross-cut design allows for multi-directional airflow. Unlike straight-fin heat sinks that require air to flow in one specific direction, cross-cut fins are efficient even if the airflow orientation changes or is turbulent. #### B. Attachment System (pushPIN™) The part utilizes a specialized push-pin mechanism. This system includes: * **Built-in Springs:** Provides precise pressure (compression) to ensure the heat sink remains in contact with the electronic component. * **Security:** Prevents the heat sink from shifting during vibration or shipping. #### C. Material and Finish * **Aluminum:** Chosen for its lightweight properties and excellent thermal conductivity. * **Blue Anodized Finish:** Increases surface emissivity and provides corrosion resistance. --- ### 3. Thermal Performance Data Performance depends on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 10.71 °C/W | | **400 LFM (2.0 m/s)** | 3.53 °C/W | | **600 LFM (3.0 m/s)** | 2.15 °C/W | --- ### 4. Typical Applications * **BGA (Ball Grid Array) Cooling:** Used for chipsets and processors. * **Telecommunications:** High-speed networking equipment. * **Embedded Systems:** Industrial PCs and automation controllers where space is limited but heat dissipation is critical.