The **ATS-08E-05-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** push-pin heatsink designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | ~14.50°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Breakdown The "electronic" functionality of this part is passive, focusing on heat dissipation to prevent component failure. #### A. Fin Pattern (Cross-Cut) The unit features a **straight fin** or **cross-cut** design. This allows for multi-directional airflow, making it versatile for systems where air may not be blowing in a single, consistent direction. #### B. Attachment Mechanism It utilizes a **push-pin and spring** system. * **Plastic Push-Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** These provide consistent downward pressure to ensure maximum contact between the heatsink base and the electronic component (CPU, FPGA, etc.), improving heat transfer. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material or high-performance thermal pad that fills microscopic air gaps between the component die and the aluminum heatsink, significantly reducing thermal impedance. --- ### 3. Common Applications This specific heatsink size and thermal profile are commonly found in: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Processing Units:** Mid-range FPGAs and ASICs.