The **ATS-08E-181-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 11.95°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Straight Fin | | **Number of Fins** | Varied based on pitch (Standard density) | --- ### 2. Key Component Features * **Heat Sink Material:** Constructed from high-quality aluminum to provide excellent thermal conductivity while remaining lightweight. * **Blue Anodized Coating:** The surface treatment is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiative heat transfer and protecting the metal from corrosion. * **Push-Pin Mounting:** This model uses a mechanical mounting system consisting of a plastic or metal pin with a compression spring. This ensures consistent pressure on the thermal interface material (TIM) and the chip, improving heat transfer. * **Low Profile:** At only 10mm in height, this part is ideal for compact electronic enclosures where vertical space is limited. --- ### 3. Applications The ATS-08E-181-C2-R0 is typically used in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed network processors. 2. **Embedded Systems:** Protecting industrial controllers from overheating. 3. **Consumer Electronics:** Use in set-top boxes or mini-PCs. 4. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the Airflow Velocity (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 11.95 | | 400 | 2.0 | 6.40 | | 600 | 3.0 | 4.63 |