The part number **ATS-08G-170-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules. ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Cross-Cut (Pin Fin) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 10.07°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The nomenclature for ATS heat sinks follows a specific logic: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **08**: Indicates the series or specific design family. * **G**: Represents the physical size category/footprint. * **170**: Relates to the specific fin height and density configuration. * **C2**: Refers to the material and finish (typically Aluminum with Blue Anodized finish). * **R0**: Indicates the revision number or packaging type. --- ### 3. Key Electronic Functions While the heat sink itself is a mechanical component, it serves critical electronic functions: 1. **Thermal Management:** It prevents "thermal throttling" of high-speed processors by dissipating heat into the ambient air. 2. **Reliability:** By maintaining a lower junction temperature ($T_j$), it extends the Mean Time Between Failures (MTBF) of the semiconductor it is attached to. 3. **Passive Cooling:** The cross-cut pin design allows for multidirectional airflow, making it ideal for crowded PCB environments where air might not flow in a single linear path. --- ### 4. Installation and Mounting This specific model uses a **push-pin** mounting system. This involves: * **Hole Pattern:** The PCB must have pre-drilled holes corresponding to the push-pin spacing. * **Compression:** The built-in springs provide consistent pressure, ensuring the Thermal Interface Material (TIM) makes optimal contact with the electronic chip.