The **ATS-08G-207-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number provides specific data regarding its dimensions, material, and thermal performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (Unducted)** | 6.39 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.32 °C/W @ 100 LFM | --- ### 2. Physical Dimensions Precision engineering ensures the heat sink fits standard PCB layouts. | Dimension | Measurement | | :--- | :--- | | **Length (A)** | 60.00 mm | | **Width (B)** | 60.00 mm | | **Height (C)** | 25.00 mm | | **Pitch (E)** | 53.00 mm | | **Pitch (F)** | 53.00 mm | --- ### 3. Key Electronic/Mechanical Features * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded pin mechanism. This provides consistent pressure (interface load) for better thermal conductivity and allows for easy removal/rework. * **XC Cut Fin Design:** The "XC" pattern features a cross-cut fin geometry. This design is optimized for "high-flow" environments, allowing air to move more efficiently through the fins from multiple directions. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or similar, ensuring a low thermal resistance path between the semiconductor and the aluminum base. * **Material Grade:** Made from AL-6063 aluminum, which offers a high thermal conductivity-to-weight ratio. --- ### 4. Application Logic In an electronic circuit, the ATS-08G-207-C2-R0 acts as a passive cooling element. To calculate the junction temperature ($T_j$) of your electronic part using this heat sink, use the following formula: ```math T_j = P \times (R_{jc} + R_{cs} + R_{sa}) + T_a ``` * **P:** Power dissipation (Watts) * **R_jc:** Junction-to-case resistance of the chip * **R_cs:** Case-to-sink resistance (TIM) * **R_sa:** Sink-to-ambient resistance (6.39 °C/W for this part) * **T_a:** Ambient temperature ---