The **ATS-08G-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 20.00mm | | **Fin Style** | Fine Pitch (Rectangular) | | **Thermal Resistance** | 11.88°C/W (at 100 LFM) to 2.13°C/W (at 700 LFM) | --- ## 2. Key Components & Features ### A. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. ### B. pushPIN™ Attachment System Instead of using messy adhesives or simple clips, this part uses a precision spring-loaded pin system: * **Springs:** Provide consistent pressure (Force) to ensure the heat sink remains in contact with the component during thermal expansion or vibration. * **Plastic/Brass Pins:** Designed to fit into pre-drilled holes on the PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) * **Pre-Applied Material:** This specific model usually comes with **T412** thermal tape or a phase-change material applied to the base. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip to maximize heat conduction. --- ## 3. Performance Overview The "G" in the part number indicates a specific fin density designed for high-performance airflow environments. ### Airflow vs. Thermal Resistance | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.88 | | 300 (1.5 m/s) | 5.02 | | 500 (2.5 m/s) | 3.30 | | 700 (3.5 m/s) | 2.13 | --- ## 4. Typical Applications * **Embedded Systems:** Industrial PCs and automation controllers. * **Networking Gear:** Small routers, switches, and SFP modules. * **Power Supplies:** Cooling MOSFETs or voltage regulators.