The **ATS-08G-54-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These parts are designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 7.00°C/W @ 100 LFM (Linear Feet per Minute) | | **Dimensions (L x W x H)** | 35mm x 35mm x 35mm | | **Fin Style** | Fine Pitch (straight fin design) | | **Interface Material** | T766 (Thermal Tape/Phase Change Material) | --- ### 2. Key Features * **Push-Pin Attachment:** It uses a spring-loaded plastic push-pin mechanism. This provides a secure, consistent pressure on the heat source, which improves thermal transfer and makes assembly faster. * **High Aspect Ratio Fins:** The "G" series from ATS features high-density fin arrays. This increases the surface area for heat dissipation without significantly increasing the footprint of the part. * **Pre-Applied Thermal Interface Material (TIM):** The "C2" suffix typically indicates that it comes with a high-performance thermal pad or tape pre-applied to the base, ensuring immediate "out-of-the-box" installation. --- ### 3. Application Use Cases This specific heatsink is ideal for: 1. **Networking Equipment:** Routers, switches, and base stations where airflow is present. 2. **Industrial PCs:** Cooling embedded processors in tight enclosures. 3. **Power Supplies:** Managing heat for MOSFETs or power ICs. ### 4. Mounting Hole Pattern To use this part, the PCB must have a specific hole pattern drilled into it: ```text Recommended Hole Size: 3.00mm Pitch (Distance between holes): ~42mm (diagonal) ```