ATS-08G-94-C2-R0
AI

The **ATS-08G-94-C2-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" heat sink line, designed for cooling integrated circuits (ICs) and electronic modules.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 25.00 mm |
| **Fin Pattern** | Fine-Pitch (increases surface area) |
| **Thermal Resistance** | ~1.30°C/W (at 200 LFM) |
| **Spring Type** | ATS-PP-08 |
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### 2. Key Components & Design Features
#### A. Fin Geometry
This model features a **cross-cut** or **fine-pitch** fin design. This maximizes the surface area within a small footprint, allowing for superior heat dissipation in forced-air (fan-cooled) environments.
#### B. pushPIN™ Attachment Mechanism
Unlike adhesive tapes or simple clips, this part uses the pushPIN™ system:
* **Compression Springs:** Provides precise, uniform pressure across the component surface to maximize thermal interface material (TIM) performance.
* **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The "R0" suffix typically indicates that the part comes with a pre-applied high-performance thermal interface material. This ensures there are no air gaps between the chip and the heat sink.
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### 3. Application Use Cases
The ATS-08G-94-C2-R0 is commonly used in:
* **Telecommunications:** Cooling high-speed processors in routers and switches.
* **Embedded Systems:** Industrial PCs where vertical space is available (25mm height).
* **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
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- ⤷
What are the specific PCB hole diameter requirements for the pushPIN attachment?
- ⤷ How does the thermal resistance of this heat sink change at different airflow speeds (LFM)?
- ⤷ Is there a low-profile alternative to this model if vertical space is limited?