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  • ATS-08G-94-C2-R0

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    The **ATS-08G-94-C2-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" heat sink line, designed for cooling integrated circuits (ICs) and electronic modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 25.00 mm | | **Fin Pattern** | Fine-Pitch (increases surface area) | | **Thermal Resistance** | ~1.30°C/W (at 200 LFM) | | **Spring Type** | ATS-PP-08 | --- ### 2. Key Components & Design Features #### A. Fin Geometry This model features a **cross-cut** or **fine-pitch** fin design. This maximizes the surface area within a small footprint, allowing for superior heat dissipation in forced-air (fan-cooled) environments. #### B. pushPIN™ Attachment Mechanism Unlike adhesive tapes or simple clips, this part uses the pushPIN™ system: * **Compression Springs:** Provides precise, uniform pressure across the component surface to maximize thermal interface material (TIM) performance. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied high-performance thermal interface material. This ensures there are no air gaps between the chip and the heat sink. --- ### 3. Application Use Cases The ATS-08G-94-C2-R0 is commonly used in: * **Telecommunications:** Cooling high-speed processors in routers and switches. * **Embedded Systems:** Industrial PCs where vertical space is available (25mm height). * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameter requirements for the pushPIN attachment?
    • ⤷ How does the thermal resistance of this heat sink change at different airflow speeds (LFM)?
    • ⤷ Is there a low-profile alternative to this model if vertical space is limited?