The **ATS-08H-141-C2-R0** is a high-performance electronic component specifically designed for thermal management. Manufactured by **Advanced Thermal Solutions (ATS)**, it belongs to the *blueICE™* series of heat sinks. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications Table | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08H-141-C2-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.76°C/W (at 100 LFM / 0.5 m/s) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits over the integrated circuit (IC) or processor without interfering with surrounding components. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height:** 10.00 mm (Low profile) * **Fin Pitch:** Fine Pitch * **Fin Pattern:** Straight Fin --- ### 3. Thermal Performance Data The efficiency of a heat sink is measured by its ability to dissipate heat based on airflow velocity (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.76 | | 300 (1.5 m/s) | 9.18 | | 500 (2.5 m/s) | 7.51 | | 700 (3.5 m/s) | 6.62 | --- ### 4. Technical Features * **pushPIN™ Attachment:** This model uses a spring-loaded mechanism that ensures even pressure across the component surface, improving heat transfer and preventing mechanical damage to the PCB. * **Material Composition:** Made from high-grade aluminum for lightweight durability and high thermal conductivity. * **Thermal Interface Material (TIM):** This specific part typically comes with **T766** pre-applied, which is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the chip. * **RoHS Compliance:** The part is lead-free and meets environmental safety standards. --- ### 5. Application Use Cases This heat sink is commonly used in electronic environments where space is limited but heat generation is high, such as: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Voltage regulators and high-speed transistors.