The **ATS-08H-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 38.00mm x 6.00mm | | **Fin Style** | Straight (Fine Pitch) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 25.25°C/W (at 100 LFM) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### Component Breakdown #### 1. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, the "pushPIN™" system uses a spring-loaded pin mechanism. This provides: * **Constant Pressure:** Ensures the thermal interface material (TIM) is compressed evenly across the chip surface. * **Secure Mounting:** Resistant to shocks and vibrations compared to thermal tape. #### 2. Thermal Interface Material (T766) This part comes pre-applied with **ATS T766**, a high-performance phase-change material. It fills microscopic air gaps between the heat source and the aluminum base to maximize heat transfer efficiency. #### 3. Low Profile Design With a height of only **6.00mm**, this heat sink is categorized as "low profile." It is ideal for: * 1U Server chassis. * Compact embedded systems. * Blade servers where vertical space is extremely limited. #### 4. Material and Finish The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat emissivity. --- ### Application Scenarios This specific part is typically used in the following electronic environments: * **Networking Gear:** Switches and routers where airflow is managed but space is tight. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Edge Computing:** Cooling small-form-factor processors in industrial settings.