The **ATS-08H-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the blueAnodized series designed for cooling semiconductor components. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimension (Length/Width)** | 40.00 mm x 40.00 mm | | **Dimension (Height)** | 15.00 mm | | **Thermal Resistance (Flowing)** | 2.30 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.49 °C/W (Unducted) | | **Fin Configuration** | Fine-Pitch (Cross-Cut) | --- ### Key Features and Component Design #### 1. Material and Coating The unit is constructed from high-grade **Aluminum**. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity, which aids in radiant heat transfer. #### 2. Fin Geometry This model features a **Fine-Pitch** design. The fins are cut in a way that creates small pins or vertical plates, maximizing the surface area relative to the volume. This is critical for forced-air cooling environments (where fans are present). #### 3. pushPIN™ Attachment System One of the defining "electronic part" features of this heat sink is its mounting mechanism: * **Compression Springs:** Uses a spring-loaded pin to ensure consistent pressure (load) on the high-heat component (like a CPU or FPGA). * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** or similar high-performance thermal grease to bridge the microscopic air gaps between the component and the heat sink. #### 4. Typical Applications This heat sink is commonly used to cool: * **BGA (Ball Grid Array)** processors. * **FPGAs** (Field Programmable Gate Arrays). * **ASICs** (Application-Specific Integrated Circuits). * High-speed network switches and routers. --- ### Thermal Performance Overview | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 4.49 | 2.30 | 1.84 | 1.60 | 1.45 | ---