The **ATS-09F-07-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-09F-07-C2-R0 | | **Heat Sink Type** | Push-pin (Blue Anodized) | | **Fin Style** | Straight Fin | | **Material** | Aluminum | | **Thermal Resistance** | 17.00°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Attachment Method** | Plastic Push-pin & Brass Spring | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## Key Features ### 1. Attachment Mechanism (Push-Pin) This part utilizes a **push-pin and spring** assembly. This provides a secure, vibration-resistant attachment to the Printed Circuit Board (PCB). The brass spring ensures constant pressure, which optimizes contact between the heat sink and the electronic component. ### 2. Material and Coating * **Aluminum:** Lightweight with high thermal conductivity. * **Blue Anodized Finish:** Increases surface emissivity and provides corrosion resistance while giving it a distinct aesthetic. ### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes with **T766** pre-applied. This is a high-performance thermal grease or phase-change material that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. ### 4. Airflow Performance The straight-fin design is optimized for environments with consistent airflow. The thermal performance improves significantly as air velocity (measured in Linear Feet per Minute - LFM) increases: * **@ 200 LFM:** ~7.50°C/W * **@ 500 LFM:** ~3.80°C/W --- ## Typical Applications * **Microprocessors:** Cooling small to medium-sized CPUs. * **Network Switches:** Heat dissipation for high-speed data processing chips. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Industrial Controls:** Components in harsh environments requiring secure mechanical mounting.