The **ATS-09F-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series, commonly used to cool integrated circuits (ICs), microprocessors, and power components. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-09F-72-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 5.10°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Features * **Straight Fin Geometry:** The fins are arranged in a parallel line pattern. This design is optimized for **undirectional airflow**, making it highly effective when placed directly in front of a system fan. * **Material (Aluminum):** Provides a balance between high thermal conductivity and low weight. The **Blue Anodized** coating protects the aluminum from corrosion and slightly improves radiant heat transfer. * **Push-Pin Attachment:** Instead of using thermal adhesive, this part uses pre-drilled holes in the PCB. The pins are spring-loaded to provide consistent pressure (interface force) against the chip, ensuring better thermal contact. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how many degrees Celsius the component's temperature will rise per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low) | 5.10 | | 300 (Medium) | 2.11 | | 500 (High) | 1.50 | --- ### 4. Integration Details To use this part effectively in a circuit design, the following must be considered: 1. **Hole Pattern:** The PCB must have specific mounting holes to accommodate the push-pins. 2. **TIM (Thermal Interface Material):** This part usually comes with a pre-applied Phase Change Material or requires a thermal pad/paste to fill microscopic air gaps between the heatsink and the chip. 3. **Spring Tension:** The "R0" designation typically refers to the specific spring force and pin material (plastic vs. brass), ensuring the mechanical stress does not damage the silicon die. ---