The **ATS-10A-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for high-efficiency cooling of semiconductor components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 2.63°C/W (at 200 LFM) | | **Flow Direction** | Rectangular / Slanted Fin | --- ### 2. Key Design Features * **maxiFLOW™ Fin Geometry:** Unlike standard square fins, this part uses a tapered fin design that increases surface area and improves airflow intake. This reduces the pressure drop across the heat sink, allowing for better heat dissipation in restricted spaces. * **pushPIN™ Attachment:** The "R0" suffix indicates a specific attachment mechanism. It uses a flexible, secure spring-loaded push-pin system. This ensures even pressure (TIM compression) across the component (like a BGA chip) to maximize heat transfer. * **Pre-applied TIM:** These units typically come with a high-performance **Thermal Interface Material (TIM)** pre-applied to the base to ensure a low-resistance thermal path between the chip and the aluminum. --- ### 3. Application Use Cases This specific model is commonly used for cooling integrated circuits (ICs) that generate significant heat in localized areas: 1. **Networking Hardware:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Supplies:** Cooling MOSFETs or power regulators. 4. **Processors:** BGA-packaged FPGAs or DSPs. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-10A-79-C2-R0 depends heavily on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.63 | | 400 (2.0 m/s) | 1.17 | | 600 (3.0 m/s) | 0.84 | ---