The **ATS-10A-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series, designed specifically for thermal management of electronic components like CPUs, GPUs, and high-power MOSFETs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Pitch (Attachment)** | 35.00mm | | **Thermal Resistance (Unducted)** | 6.29 °C/W @ 100 LFM | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (Straight Fin) The "85" in the part number designates the specific fin pattern. This model features a **Straight Fin** design. * **Function:** It is optimized for cross-flow air patterns. * **Advantage:** Provides a low pressure drop, making it ideal for systems with standard cooling fans. #### B. Attachment Mechanism (pushPIN™) Unlike traditional adhesive-only heat sinks, this part uses a mechanical push-pin system. * **Compression Spring:** Ensures consistent pressure between the heat sink and the electronic component (die). * **Hardware:** Available in brass or plastic pins with stainless steel springs for durability and vibration resistance. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal tape**. * **Purpose:** To fill microscopic air gaps between the heat sink base and the chip surface, maximizing heat transfer. --- ### 3. Part Number Decoder Understanding the "Electronic DNA" of this part: | Segment | Meaning | | :--- | :--- | | **ATS-10** | Series ID (Push-pin type) | | **A** | Standard Attachment/Material | | **85** | Fin Design/Geometry Code | | **C2** | Thermal Performance Grade / Material Type | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications This component is typically found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Computing:** Industrial PC motherboards. * **Power Electronics:** Cooling for VRMs (Voltage Regulator Modules).