ATS-10D-159-C2-R0
AI

The **ATS-10D-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs), such as CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table outlines the key physical and thermal characteristics of this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Brass/Plastic pins) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 20mm |
| **Thermal Resistance** | 2.09°C/W (at 200 LFM) |
| **Fin Pattern** | XC-Cut (Cross-cut) |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by ATS to identify the cooling capability and mounting style:
* **ATS**: Manufacturer prefix (Advanced Thermal Solutions).
* **10D**: Indicates the attachment series (pushPIN™ style).
* **159**: Refers to the specific fin geometry and size profile.
* **C2**: Refers to the material and finish (Blue Anodized Aluminum).
* **R0**: Indicates the revision or specific packaging/spring tension variant.
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### 3. Key Features & Benefits
* **pushPIN™ Attachment:** This system features a flexible mounting mechanism that uses a compression spring to ensure a consistent, secure interface between the heat sink and the electronic component.
* **High Performance:** The cross-cut (XC) fin design allows for multi-directional airflow, making it efficient even in systems where the direction of the cooling fan may vary.
* **Pre-applied Thermal Interface Material (TIM):** Most units in this series come with a high-performance thermal pad or grease already applied to the base, ensuring low thermal resistance immediately upon installation.
* **Lightweight:** Being made of aluminum, it provides a high surface-area-to-weight ratio, preventing mechanical stress on the PCB.
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### 4. Typical Applications
The ATS-10D-159-C2-R0 is commonly used in:
1. **Telecommunications:** Networking switches and routers.
2. **Industrial Computing:** Embedded systems that run in high-temperature environments.
3. **Power Electronics:** Cooling MOSFETs or power regulators.
4. **Consumer Electronics:** High-end audio/visual processing units.
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What is the significance of the 2.09°C/W thermal resistance rating in a real-world application?
- ⤷ How do pushPIN mounts compare to adhesive thermal tapes for PCB safety?
- ⤷ Are there alternative materials like copper available for this specific heat sink profile?