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  • ATS-10D-159-C2-R0

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    The **ATS-10D-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | 2.09°C/W (at 200 LFM) | | **Fin Pattern** | XC-Cut (Cross-cut) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the cooling capability and mounting style: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **10D**: Indicates the attachment series (pushPIN™ style). * **159**: Refers to the specific fin geometry and size profile. * **C2**: Refers to the material and finish (Blue Anodized Aluminum). * **R0**: Indicates the revision or specific packaging/spring tension variant. --- ### 3. Key Features & Benefits * **pushPIN™ Attachment:** This system features a flexible mounting mechanism that uses a compression spring to ensure a consistent, secure interface between the heat sink and the electronic component. * **High Performance:** The cross-cut (XC) fin design allows for multi-directional airflow, making it efficient even in systems where the direction of the cooling fan may vary. * **Pre-applied Thermal Interface Material (TIM):** Most units in this series come with a high-performance thermal pad or grease already applied to the base, ensuring low thermal resistance immediately upon installation. * **Lightweight:** Being made of aluminum, it provides a high surface-area-to-weight ratio, preventing mechanical stress on the PCB. --- ### 4. Typical Applications The ATS-10D-159-C2-R0 is commonly used in: 1. **Telecommunications:** Networking switches and routers. 2. **Industrial Computing:** Embedded systems that run in high-temperature environments. 3. **Power Electronics:** Cooling MOSFETs or power regulators. 4. **Consumer Electronics:** High-end audio/visual processing units.
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 2.09°C/W thermal resistance rating in a real-world application?
    • ⤷ How do pushPIN mounts compare to adhesive thermal tapes for PCB safety?
    • ⤷ Are there alternative materials like copper available for this specific heat sink profile?