ATS-10E-142-C2-R0
AI

The **ATS-10E-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Property | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-10E-142-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions** | 30mm x 30mm x 15mm |
| **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 200 LFM) |
| **Pattern** | High-performance square pin fin |
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### 2. Key Design Features
* **Pin Fin Geometry:** Unlike standard straight fins, the square pin fin design increases surface area and promotes turbulence in the airflow, which significantly enhances heat dissipation in low-airflow environments.
* **Push-Pin Attachment:** This model uses a plastic push-pin mechanism with a built-in spring. This ensures:
* **Consistent Pressure:** Provides a precise amount of force on the electronic component for optimal thermal contact.
* **Secure Mounting:** Reduces the risk of the heat sink shifting during vibration or shipping.
* **Blue Anodized Coating:** The blue anodization is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat transfer.
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### 3. Application Use Cases
The ATS-10E-142-C2-R0 is typically used in the following scenarios:
1. **Telecommunications:** Cooling of high-speed networking chips and switch fabric processors.
2. **Embedded Systems:** Ideal for small form factor industrial computers where vertical space is limited to 15mm.
3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs) or high-power MOSFETs.
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### 4. Thermal Performance Comparison
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 10.07 |
| 400 (2.0 m/s) | 4.65 |
| 600 (3.0 m/s) | 3.35 |
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- ⤷
What is the hole-to-hole spacing required for mounting this heat sink?
- ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
- ⤷ Are there copper versions of this heat sink for higher heat loads?