The **ATS-10E-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Thermal Resistance (Flowing Air)** | 4.84 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 11.95 °C/W | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10E**: Product series/category. * **18**: Dimensional code (refers to specific length/width footprint). * **C2**: Material and Finish code (specifically Blue Anodized Aluminum). * **R0**: Revision or specific packaging/material variant. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it is vital to the electronic system for the following reasons: 1. **Thermal Dissipation**: It increases the surface area of a hot component (like a CPU, FPGA, or MOSFET), allowing air to carry away heat more efficiently. 2. **Thermal Interface Material (TIM)**: The **T766** pre-applied to the bottom fills microscopic air gaps between the component and the heat sink, ensuring maximum heat transfer. 3. **Mechanical Attachment**: The **Push Pin** system provides a consistent "clamping force," which is critical for maintaining the thermal bond without damaging the PCB. --- ### 4. Application Use-Cases * **Networking Equipment**: Switches and routers where airflow is managed. * **Power Supplies**: Dissipating heat from voltage regulators. * **Embedded Systems**: Cooling microprocessors on industrial motherboards.