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  • ATS-10E-36-C2-R0

  • AI
    The **ATS-10E-36-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for the thermal management of electronic components such as CPUs, GPUs, and other high-power semiconductors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 15mm | | **Thermal Resistance** | 14.82°C/W (Unducted Flow @ 100 LFM) | | **Flow Direction** | Vertical / Omni-directional | | **Weight** | ~25 grams | --- ### 2. Key Design Features #### A. pushPIN™ Attachment System This part utilizes a specialized mounting mechanism designed for quick and secure assembly. * **Performance:** Provides a consistent attachment force to ensure optimal contact with the heat source. * **Hardware:** Includes a brass component and a stainless steel spring to prevent degradation over time. #### B. High-Performance Thermal Interface Material (TIM) The "C2" suffix in the part number indicates that it comes pre-applied with **ATS-PPS-12**, a high-performance thermal grease. This eliminates the need for manual application and ensures minimal thermal resistance between the chip and the heat sink. #### C. Fin Geometry The sink uses a specialized "mini-fin" design. This increases the surface area significantly compared to standard extruded heat sinks, allowing for better heat dissipation in airflow-restricted environments. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **10E:** Series designation (High-performance pushPIN™). * **36:** Length/Width base (Approx. 36mm). * **C2:** Thermal Interface Material (T766/ATS-PPS-12) and Blue Anodized finish. * **R0:** Revision code. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.82 | | 200 (1.0 m/s) | 8.18 | | 300 (1.5 m/s) | 6.57 | | 500 (2.5 m/s) | 5.06 | ---
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern required on the PCB for the pushPIN™ attachment?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied C2 grease?
    • ⤷ How does the 'Blue Anodized' finish affect the thermal radiation performance?