ATS-10E-36-C2-R0
AI

The **ATS-10E-36-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for the thermal management of electronic components such as CPUs, GPUs, and other high-power semiconductors.
---
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 15mm |
| **Thermal Resistance** | 14.82°C/W (Unducted Flow @ 100 LFM) |
| **Flow Direction** | Vertical / Omni-directional |
| **Weight** | ~25 grams |
---
### 2. Key Design Features
#### A. pushPIN™ Attachment System
This part utilizes a specialized mounting mechanism designed for quick and secure assembly.
* **Performance:** Provides a consistent attachment force to ensure optimal contact with the heat source.
* **Hardware:** Includes a brass component and a stainless steel spring to prevent degradation over time.
#### B. High-Performance Thermal Interface Material (TIM)
The "C2" suffix in the part number indicates that it comes pre-applied with **ATS-PPS-12**, a high-performance thermal grease. This eliminates the need for manual application and ensures minimal thermal resistance between the chip and the heat sink.
#### C. Fin Geometry
The sink uses a specialized "mini-fin" design. This increases the surface area significantly compared to standard extruded heat sinks, allowing for better heat dissipation in airflow-restricted environments.
---
### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying the specific configuration:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **10E:** Series designation (High-performance pushPIN™).
* **36:** Length/Width base (Approx. 36mm).
* **C2:** Thermal Interface Material (T766/ATS-PPS-12) and Blue Anodized finish.
* **R0:** Revision code.
---
### 4. Thermal Performance Comparison
Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 14.82 |
| 200 (1.0 m/s) | 8.18 |
| 300 (1.5 m/s) | 6.57 |
| 500 (2.5 m/s) | 5.06 |
---
- ⤷
What is the hole pattern required on the PCB for the pushPIN™ attachment?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied C2 grease?
- ⤷ How does the 'Blue Anodized' finish affect the thermal radiation performance?