The **ATS-10F-01-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" series, designed for efficient cooling of integrated circuits (ICs) and other electronic chips. --- ## 1. Technical Specifications The following table outlines the key technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Top Mount (Square/Rectangular) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 21.90°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height (Off Base)** | 6.00mm | | **Finish** | Blue Anodized | --- ## 2. Key Component Features ### A. Fin Profile (Fine Pitch) The heatsink features a high-density fin structure. Because the height is relatively low (6mm), the fins are designed to maximize surface area within a small vertical profile, making it ideal for compact enclosures or 1U rack servers. ### B. Push-Pin Attachment The "-R0" suffix indicates the inclusion of a specialized attachment mechanism: * **Spring-loaded Push-Pins:** These provide a consistent, pre-determined pressure (clamping force) on the chip to ensure optimal thermal interface contact. * **Compression Springs:** They prevent the heatsink from shifting during mechanical shock or vibration. ### C. Thermal Performance (LFM) The performance varies based on the airflow (Linear Feet per Minute): * **100 LFM:** 21.90 °C/W * **300 LFM:** 5.40 °C/W * **600 LFM:** 3.00 °C/W * *Observation:* This heatsink is highly dependent on active airflow to be effective. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **10F** | Fin style/Pitch category | | **01** | Specific dimensions/series reference | | **C1** | Material/Thermal Interface (Usually indicates high performance) | | **R0** | RoHS compliance and revision status | --- ## 4. Usage Considerations * **Thermal Interface Material (TIM):** While the heatsink provides the cooling surface, a high-quality thermal paste or pad is required between the IC and the aluminum base to bridge microscopic air gaps. * **PCB Layout:** Since this uses push-pins, the PCB must have pre-drilled holes at specific coordinates (typically 33mm x 33mm spacing for this 40mm model) to accommodate the brass pins.