The **ATS-10F-47-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** Heat Sink series, designed for high-performance thermal management of electronic integrated circuits (ICs). ### 1. Component Specifications The following table outlines the physical and technical attributes of this specific model: | Attribute | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Fin Profile** | Straight / Square | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 30mm | --- ### 2. Thermal Performance Thermal resistance is measured based on the airflow (velocity) across the fins. This component is optimized for vertical airflow. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.03 | | 300 (1.5 m/s) | 3.51 | | 500 (2.5 m/s) | 2.50 | | 700 (3.5 m/s) | 2.03 | --- ### 3. Key Electronic Features #### A. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the "pushPIN" system uses a brass or plastic pin with a compressed spring. This ensures: * **Constant Pressure:** Maintains a consistent interface between the chip and the heat sink for better heat transfer. * **Reliability:** Resistant to vibration and mechanical shock. * **Reusability:** Can be easily removed and reinstalled during PCB repair. #### B. Material and Coating * **AL6063 Aluminum:** Provides a high thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves corrosion resistance. #### C. Thermal Interface Material (TIM) The **C2** designation in the part number indicates that this unit typically comes with **T766** pre-applied thermal phase-change material or high-performance grease, ensuring minimal thermal resistance at the contact point. --- ### 4. Typical Applications * **CPUs/GPUs:** Small form factor processors. * **Telecommunications:** Network switches and routers. * **Industrial Power Supplies:** Cooling power transistors and MOSFETs. * **Embedded Systems:** High-density PCBs where space is at a premium.