The **ATS-10G-142-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their **maxiFLOW™** series, specifically designed for high-density electronic cooling where airflow is constrained or directed. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (typically Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (Fin Height)** | 17.78mm | | **Thermal Resistance** | ~4.50° C/W (at 100 LFM) | | **Fin Pattern** | maxiFLOW (Flared Fin) | --- ### 2. Key Electronic Components & Features #### A. Flared Fin Design (maxiFLOW™) Unlike standard straight-fin heat sinks, the fins on this model flare outward. This design: * Reduces pressure drop across the heat sink. * Increases the surface area for heat dissipation. * Optimizes cooling in environments with low-to-medium airflow velocity. #### B. pushPIN™ Attachment System This is the "mechanical" part of the electronic assembly. It consists of: * **Compression Springs:** Provide specific, consistent pressure on the processor or component to ensure optimal thermal contact. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB, preventing shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the unit comes with a **pre-applied Thermal Interface Material**. This is a phase-change material or high-performance thermal pad that fills microscopic air gaps between the heat sink and the electronic chip (e.g., FPGA, GPU, or CPU). --- ### 3. Application Use Cases This part is commonly used to cool the following electronic components: 1. **High-Speed Networking Chips:** SFP+ modules or 10G Ethernet controllers. 2. **FPGAs & ASICs:** Integrated circuits that generate significant heat in a small footprint. 3. **Power Converters:** High-density DC-DC converters that require compact cooling solutions. --- ### 4. Thermal Performance Data *Approximate values based on airflow:* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.50 | | 300 | 1.5 | 2.10 | | 500 | 2.5 | 1.60 |