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  • ATS-10G-40-C2-R0

  • AI
    The **ATS-10G-40-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance heat sink series designed for thermal management in electronic systems. Below is a detailed breakdown of the part's specifications and features. --- ### 1. Component Overview The ATS-10G-40-C2-R0 is a **push-pin heat sink** featuring a high-efficiency "cross-cut" fin design. It is designed to be mounted directly onto Integrated Circuits (ICs) like CPUs, GPUs, or FPGAs. ### 2. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Straight Fin (Cross-Cut) | | **Dimensions** | 40mm x 40mm | | **Height** | 10mm | | **Thermal Resistance** | Approx. 7.10 °C/W (at 200 LFM) | | **Spring Type** | Compression Spring | --- ### 3. Key Electronic/Mechanical Features * **Thermal Interface Material (TIM):** This specific part number usually includes a pre-applied thermal pad (typically **Chomerics T766**) on the base to ensure optimal heat transfer between the chip and the aluminum. * **Push-Pin Attachment:** The "C2" in the part number often refers to the specific attachment kit. It uses a plastic push-pin and a brass/steel spring to provide a precise amount of pressure (load) on the electronic component, ensuring the heat sink doesn't shift under vibration. * **Airflow Optimization:** The cross-cut fin geometry allows for omnidirectional airflow, meaning it can dissipate heat effectively regardless of which direction the fan is blowing across the PCB. ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **10G** | Refers to the height (10mm) and specific fin geometry | | **40** | Width/Length of the base (40mm x 40mm) | | **C2** | Attachment/Hardware code (Push-pin type and spring tension) | | **R0** | RoHS compliance version / Revision code | --- ### 5. Common Applications * **Telecommunications:** Cooling network switches and routers. * **Industrial PC:** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.
    ✨ Follow-up Questions
    • ⤷ What are the alternative mounting methods for this heat sink if push-pins cannot be used?
    • ⤷ How do I calculate if the 7.10 °C/W thermal resistance is sufficient for my specific chip?
    • ⤷ What is the difference between the C1 and C2 hardware variants in ATS part numbers?