ATS-10G-40-C2-R0
AI

The **ATS-10G-40-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance heat sink series designed for thermal management in electronic systems.
Below is a detailed breakdown of the part's specifications and features.
---
### 1. Component Overview
The ATS-10G-40-C2-R0 is a **push-pin heat sink** featuring a high-efficiency "cross-cut" fin design. It is designed to be mounted directly onto Integrated Circuits (ICs) like CPUs, GPUs, or FPGAs.
### 2. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Anodized) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Fin Type** | Straight Fin (Cross-Cut) |
| **Dimensions** | 40mm x 40mm |
| **Height** | 10mm |
| **Thermal Resistance** | Approx. 7.10 °C/W (at 200 LFM) |
| **Spring Type** | Compression Spring |
---
### 3. Key Electronic/Mechanical Features
* **Thermal Interface Material (TIM):** This specific part number usually includes a pre-applied thermal pad (typically **Chomerics T766**) on the base to ensure optimal heat transfer between the chip and the aluminum.
* **Push-Pin Attachment:** The "C2" in the part number often refers to the specific attachment kit. It uses a plastic push-pin and a brass/steel spring to provide a precise amount of pressure (load) on the electronic component, ensuring the heat sink doesn't shift under vibration.
* **Airflow Optimization:** The cross-cut fin geometry allows for omnidirectional airflow, meaning it can dissipate heat effectively regardless of which direction the fan is blowing across the PCB.
### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) |
| **10G** | Refers to the height (10mm) and specific fin geometry |
| **40** | Width/Length of the base (40mm x 40mm) |
| **C2** | Attachment/Hardware code (Push-pin type and spring tension) |
| **R0** | RoHS compliance version / Revision code |
---
### 5. Common Applications
* **Telecommunications:** Cooling network switches and routers.
* **Industrial PC:** Thermal management for embedded processors.
* **Power Supplies:** Heat dissipation for MOSFETs and power regulators.
- ⤷
What are the alternative mounting methods for this heat sink if push-pins cannot be used?
- ⤷ How do I calculate if the 7.10 °C/W thermal resistance is sufficient for my specific chip?
- ⤷ What is the difference between the C1 and C2 hardware variants in ATS part numbers?