The part number **ATS-10G-77-C2-R0** refers to a high-performance **heat sink** assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, designed specifically for cooling high-heat electronic components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Body), Blue Anodized Finish | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 2.50°C/W @ 200 LFM | | **Dimensions (L x W)** | 37.00mm x 37.00mm | | **Height** | 17.50mm | --- ### 2. Key Features and Design #### A. maxiFLOW™ Fin Geometry The "G" in the part number signifies the **cross-cut fin design**. This profile increases the surface area and encourages turbulent airflow, which significantly improves thermal performance compared to standard straight-fin heat sinks. #### B. maxiGRIP™ Attachment System The **-C2** designation refers to the attachment mechanism. * **Frame Clip:** It uses a plastic frame clip that snaps around the component. * **Steady Pressure:** A gold-colored "superGrip" spring clip applies constant pressure across the center of the heat sink. * **No Holes Required:** This system does not require holes in the PCB, making it ideal for high-density layouts. #### C. Thermal Interface Material (TIM) The **-R0** suffix indicates that the unit comes pre-applied with a high-performance thermal interface material (typically a phase-change material or thermal pad) to ensure efficient heat transfer from the chip to the aluminum fins. --- ### 3. Electronic Application Use Cases This component is typically used in the following scenarios: * **Networking Hardware:** Cooling CPUs and ASICs in routers and switches. * **Embedded Systems:** Industrial PCs where vertical space (17.5mm) is available but lateral space is tight. * **Power Electronics:** Cooling high-speed FPGAs (Field Programmable Gate Arrays) or BGAs that generate significant localized heat. ---