The **ATS-10H-32-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for electronic devices (such as CPUs, FPGAs, or GPUs) that require efficient heat dissipation in confined spaces. ### 1. Component Specifications The following table summarizes the technical characteristics based on the part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Passive/Active Air Cooling) | | **Fin Style** | Blue Anodized, Straight Fin | | **Material** | Aluminum | | **Thermal Resistance** | ~9.60 °C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Thermal Interface** | Pre-applied T766 Phase Change Material | --- ### 2. Physical Dimensions The part number defines the physical footprint, which is crucial for PCB layout design: * **Length:** 54.00 mm * **Width:** 54.00 mm * **Height:** 12.70 mm * **Fin Pitch:** High-density arrangement for maximum surface area. --- ### 3. Decoding the Part Number Advanced Thermal Solutions uses a standardized naming convention to describe the part's attributes: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **10H**: Series designation (Push-pin attachment style). 3. **32**: Specific physical size/configuration index. 4. **C2**: Material and Finish (typically refers to Blue Anodized Aluminum). 5. **R0**: RoHS Compliance status and revision level. --- ### 4. Application and Installation This component is used to manage the **Thermal Design Power (TDP)** of integrated circuits. * **Attachment:** It uses a "Push-Pin" mechanism. This involves two holes drilled into the PCB; the pins use internal springs to provide constant pressure against the chip, ensuring a secure thermal bond. * **Thermal Interface Material (TIM):** This specific model comes with **T766**, a high-performance phase-change material. When the chip heats up, the material softens to fill microscopic air gaps between the chip and the heat sink, significantly improving heat transfer. * **Airflow:** It is designed for "cross-cut" or "straight-line" airflow, meaning it performs best when a system fan is blowing air directly through the fins.