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  • ATS-10H-68-C2-R0

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    The **ATS-10H-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Pitch** | Fine Pitch (Cross-Cut) | --- ## 2. Key Design Features ### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the "R0" designation indicates a **push-pin mounting system**. This uses a spring-loaded mechanism that provides: * **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for maximum heat transfer. * **Security:** High vibration resistance compared to clip-on heat sinks. * **Ease of Installation:** Pre-drilled holes in the PCB allow for quick assembly. ### B. Cross-Cut Fin Design The heat sink features a **straight fin, cross-cut pattern**. This geometry is optimized for: * **Omnidirectional Airflow:** It can receive cooling air from multiple directions, making it versatile for different fan placements. * **Surface Area:** Maximizes the area available for heat to escape into the atmosphere. ### C. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** Not just for aesthetics; the anodization increases the surface emissivity and protects the aluminum from environmental corrosion. --- ## 3. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 3.94 °C/W | 15.31 °C/W | | 300 (1.5 m/s) | 2.02 °C/W | 4.43 °C/W | | 500 (2.5 m/s) | 1.57 °C/W | 2.59 °C/W | --- ## 4. Part Number Breakdown `ATS - 10 H - 68 - C2 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **10:** Series type. * **H:** Attachment type (Push-Pin). * **68:** Fin pattern/size code. * **C2:** Material/Finish (Aluminum, Blue Anodized). * **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷What type of thermal interface material (TIM) is recommended for use with this heat sink?
    • ⤷ How do I calculate the required hole diameter on the PCB for the push-pins?
    • ⤷ What is the difference between ducted and unducted thermal resistance in this context?