ATS-10H-68-C2-R0
AI

The **ATS-10H-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 15mm |
| **Pitch** | Fine Pitch (Cross-Cut) |
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## 2. Key Design Features
### A. pushPIN™ Attachment
Unlike adhesive tapes or simple clips, the "R0" designation indicates a **push-pin mounting system**. This uses a spring-loaded mechanism that provides:
* **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for maximum heat transfer.
* **Security:** High vibration resistance compared to clip-on heat sinks.
* **Ease of Installation:** Pre-drilled holes in the PCB allow for quick assembly.
### B. Cross-Cut Fin Design
The heat sink features a **straight fin, cross-cut pattern**. This geometry is optimized for:
* **Omnidirectional Airflow:** It can receive cooling air from multiple directions, making it versatile for different fan placements.
* **Surface Area:** Maximizes the area available for heat to escape into the atmosphere.
### C. Material and Finish
* **Aluminum 6063:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized Coating:** Not just for aesthetics; the anodization increases the surface emissivity and protects the aluminum from environmental corrosion.
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## 3. Thermal Performance Data
Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) |
| :--- | :--- | :--- |
| 100 (0.5 m/s) | 3.94 °C/W | 15.31 °C/W |
| 300 (1.5 m/s) | 2.02 °C/W | 4.43 °C/W |
| 500 (2.5 m/s) | 1.57 °C/W | 2.59 °C/W |
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## 4. Part Number Breakdown
`ATS - 10 H - 68 - C2 - R0`
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **10:** Series type.
* **H:** Attachment type (Push-Pin).
* **68:** Fin pattern/size code.
* **C2:** Material/Finish (Aluminum, Blue Anodized).
* **R0:** Revision/Packaging code.
- ⤷What type of thermal interface material (TIM) is recommended for use with this heat sink?
- ⤷ How do I calculate the required hole diameter on the PCB for the push-pins?
- ⤷ What is the difference between ducted and unducted thermal resistance in this context?