The **ATS-10H-80-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure stability and longevity. --- ### 1. Technical Specifications The following table breaks down the technical characteristics based on the part number nomenclature: | Feature | Specification | Description | | :--- | :--- | :--- | | **Heat Sink Type** | Push-Pin | Uses a spring-loaded push-pin for attachment | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Dimensions** | 30mm x 30mm | Length and Width (Compact form factor) | | **Height** | 25mm | Vertical clearance required | | **Fin Style** | Straight Fin | Optimized for linear airflow | | **Thermal Resistance** | 3.75°C/W | Efficiency at 200 LFM (Linear Feet per Minute) | | **Attachment** | Push-Pin (Plastic) | 2-hole pattern for PCB mounting | | **Interface Material** | T766 | Pre-applied Phase Change Material (Thermal Pad) | | **Finish** | Blue Anodized | Corrosion resistance and aesthetic finish | --- ### 2. Component Composition The "parts" of this specific assembly include: 1. **The Heat Sink Body:** Extruded aluminum block with vertical fins. The fins increase the surface area contact with the air. 2. **Push-Pins:** Usually made of nylon or durable plastic, these act as the fasteners to the Printed Circuit Board (PCB). 3. **Springs:** Stainless steel springs provide a consistent downward pressure (clamping force) to ensure the heat sink makes firm contact with the chip. 4. **Thermal Interface Material (TIM):** A pre-applied layer of thermal grease or a phase-change pad on the base to fill microscopic air gaps between the component and the heat sink. --- ### 3. Application and Use Cases This component is typically found in: * **Embedded Systems:** Industrial PCs and small-form-factor controllers. * **Telecommunications:** Cooling of high-speed networking chips. * **Power Supplies:** Managing heat in MOSFETs and voltage regulators. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Brand) * **10H:** Series/Family designator * **80:** Specific dimension/height profile * **C2:** Blue Anodized finish * **R0:** Standard Revision/Packaging code