The **ATS-10H-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 20.30°C/W (Unducted) to 1.14°C/W (Ducted @ 200 LFM) | | **Weight** | ~40 grams | --- ### 2. Physical Dimensions The part follows a square/rectangular profile optimized for high-density PCB layouts. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 10.00 mm (Low profile) * **Pitch (Hole Pattern):** 38.00 mm --- ### 3. Key Features and Component Design #### A. Fin Pattern (Cross-Cut) The "97" in the part number indicates a specific fin design. This model utilizes a **high-density fin structure** (often a cross-cut or mini-channel design) that increases the surface area for heat exchange without significantly obstructing airflow. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or complex screws, this part uses the **pushPIN™** system: * **Spring-loaded mechanism:** Ensures constant, uniform pressure on the heat source (TIM - Thermal Interface Material). * **Ease of Install:** Allows for quick assembly and disassembly during prototyping or repair. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; anodization increases emissivity and protects the aluminum from corrosion and electrical conductivity on the surface. --- ### 4. Thermal Performance Comparison The effectiveness of this part varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 20.30 | 4.45 | 2.50 | --- ### 5. Application Use-Cases * **Telecommunications:** Cooling of ASICs and FPGA chips in routers and switches. * **Embedded Systems:** Industrial PCs where vertical space is limited (10mm height). * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.