ATS-11B-161-C2-R0
AI

The **ATS-11B-161-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management series, designed specifically for cooling electronic components like CPUs, GPUs, and power modules.
---
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 20mm |
| **Attachment Type** | pushPIN™ |
| **Pitch** | Fine Pitch |
| **Thermal Resistance** | 4.74 °C/W (at 100 LFM) |
---
### 2. Key Electronic & Mechanical Features
#### A. Attachment Mechanism (pushPIN™)
This part utilizes a pushPIN™ system which consists of a flexible spring and a plastic or brass pin.
* **Benefits:** Ensures high-pressure contact between the heat sink and the electronic component to maximize heat transfer.
* **Reliability:** Designed to meet high-vibration requirements in industrial and telecommunications environments.
#### B. Thermal Interface Material (TIM)
The "C2" suffix in the part number indicates the pre-applied thermal material.
* **Material:** T766 (Thermal Grease).
* **Function:** Fills microscopic air gaps between the component surface and the heat sink base to minimize thermal resistance.
#### C. Fin Design
The heat sink features a **Fine Pitch** straight-fin pattern.
* **High Surface Area:** Increases the contact area with the surrounding air.
* **Optimized Airflow:** Best suited for systems with dedicated forced-air cooling (fans).
---
### 3. Applications in Electronics
The ATS-11B-161-C2-R0 is commonly used for:
1. **Semiconductor Cooling:** Ideal for FPGAs, ASICs, and high-speed processors.
2. **Embedded Systems:** Used in compact industrial PCs where vertical space (20mm) is restricted.
3. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power conversion modules.
---
### 4. Part Number Breakdown
`ATS-11B-161-C2-R0`
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **11:** Series Number
* **B:** Attachment (pushPIN™)
* **161:** Size/Fin Configuration ID
* **C2:** Thermal Interface (T766 Grease)
* **R0:** RoHS compliant (Environmental standard)
- ⤷
What is the mounting hole pattern required for this heat sink?
- ⤷ Can this heat sink be used for passive cooling without a fan?
- ⤷ Are there alternative spring types available for different pressure requirements?