The **ATS-11F-07-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** push-pin heat sink designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal characteristics of the heat sink. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass) | | **Base Dimensions** | 45mm x 45mm | | **Height (Fin)** | 12.7mm | | **Thermal Interface Material** | T412 (Pre-applied) | | **Fin Style** | Straight Fin | --- ## 2. Component Breakdown ### A. Material and Coating The heat sink is manufactured from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The "R0" at the end of the part number typically signifies a Blue Anodized finish, which provides: * Corrosion resistance. * Increased surface emissivity for better radiant cooling. * Electrical insulation of the aluminum surface. ### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-11F** uses a mechanical push-pin system. * **Engagement:** The brass pins are spring-loaded. When pressed through pre-drilled holes in a PCB, they lock firmly. * **Compression:** The springs ensure consistent pressure across the surface of the chip, which is critical for minimizing thermal resistance. ### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**. This is a high-performance thermal pad that fills the microscopic air gaps between the chip and the heat sink base, ensuring efficient heat transfer from the silicon to the aluminum fins. --- ## 3. Thermal Performance Indicators The efficiency of this part is measured by its **Thermal Resistance** (°C/W). Lower values indicate better cooling performance. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **@1.0 m/s (200 LFM)** | ~5.00 °C/W | | **@2.5 m/s (500 LFM)** | ~2.50 °C/W | | **@3.5 m/s (700 LFM)** | ~2.10 °C/W | --- ## 4. Usage Considerations * **PCB Layout:** This component requires two specific holes drilled into the PCB at a pitch of approximately **38mm**. * **Clearance:** Because the height is 12.7mm, it is considered a "Low Profile" heat sink, making it suitable for 1U server racks or compact embedded enclosures.