The **ATS-11F-08-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs where space is limited but thermal dissipation requirements are high. --- ### 1. Key Technical Specifications The model name contains coded information about its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.32 °C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Weight** | ~40 grams | --- ### 2. Physical Design Features #### Fine Pitch Fin Design The "F" in the part number indicates a **Fine Pitch** fin geometry. This design maximizes the surface area within a small footprint, making it ideal for high-velocity airflow environments where forced convection (fans) is present. #### Attachment Mechanism (pushPIN™) Unlike simple adhesive tapes, this part uses the **pushPIN™** system. This consists of: * **Plastic/Brass Pins:** Flexible pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide consistent pressure (Force) across the interface, ensuring optimal contact between the heat sink and the chip. #### Thermal Interface Material (TIM) The unit comes pre-applied with **T412** or similar high-performance thermal grease. This eliminates the need for manual application and ensures there are no air gaps between the component and the metal surface. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 14.32 | | 300 (Medium Flow) | 4.45 | | 500 (High Flow) | 2.64 | --- ### 4. Applications * **Telecommunications:** High-speed routers and switches. * **Industrial PC:** Embedded systems requiring rugged cooling. * **Power Electronics:** Cooling MOSFETs or power modules in compact enclosures.