The part number **ATS-11G-75-C3-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and other high-heat chipsets. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push PIN | | **Fin Configuration** | Straight Fin | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Thermal Resistance** | 2.55°C/W (at 200 LFM) | | **Attachment Method** | Plastic Push Pin & Compression Spring | | **Interface Material** | T766 (Thermal Tape/Grease included) | --- ### 2. Breakdown of the Part Number The nomenclature describes the mechanical and thermal characteristics: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **11G:** Indicates the series (push-pin attachment type). * **75:** Refers to the specific fin density and geometry for this height. * **C3:** Denotes the color/finish and material (typically Black Anodized Aluminum). * **R0:** Revision code (Standard RoHS compliant). --- ### 3. Key Electronic/Physical Components #### A. The Heat Sink Body The body is made of **Aluminum**, chosen for its excellent thermal conductivity-to-weight ratio. The **Black Anodized finish** is not just for aesthetics; it increases the surface emissivity, which improves heat dissipation through radiation. #### B. The Push-Pin Mechanism Instead of adhesive tape or solder, this part uses a **spring-loaded push-pin system**. * **Purpose:** Ensures consistent pressure (clamping force) on the electronic component. * **Benefit:** Provides better contact with the die and allows for thermal expansion without cracking the PCB. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766 phase-change material**. This fills the microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance compared to dry contact. --- ### 4. Applications This part is commonly used in: * **Telecommunications:** Cooling high-speed processors in routers and switches. * **Embedded Systems:** Industrial PCs where vibration resistance (via push-pins) is required. * **Power Supplies:** Cooling MOSFETs or small voltage regulators. ---