The **ATS-11H-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for precision cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Mounting Type** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Attachment Method** | Through-hole | | **Thermal Resistance** | 20.17 °C/W (Unducted @ 100 LFM) | --- ### 2. Component Design & Anatomy #### A. Fin Profile (Straight Fin) The "06" in the part number indicates a specific fin pattern. This model uses a **straight-fin** design, which provides a large surface area for heat dissipation. It is best suited for environments with a steady, directed airflow. #### B. Attachment Mechanism (pushPIN™) Instead of messy thermal adhesives or complex screws, this part uses a spring-loaded push-pin system: * **Uniform Pressure:** Ensures consistent contact between the heat sink base and the electronic component (CPU/GPU/FPGA). * **Vibration Resistance:** The compression springs absorb mechanical shocks, making it ideal for industrial or automotive electronics. #### C. Thermal Interface Material (TIM) The "R0" designation typically implies the inclusion of a pre-applied **Thermal Interface Material**. This fills microscopic air gaps between the heat sink and the chip to maximize heat transfer efficiency. --- ### 3. Applications This part is commonly used in the following electronic sectors: * **Telecommunications:** Cooling high-speed networking switches. * **Data Centers:** Thermal management for server processors. * **Embedded Systems:** Industrial PC cooling where vertical clearance is limited to 25mm. --- ### 4. Cooling Performance (Airflow) The thermal resistance decreases as the airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 20.17 | | 300 (1.5 m/s) | 5.48 | | 500 (2.5 m/s) | 3.30 |