The **ATS-11H-52-C2-R0** is a high-performance thermal management component, specifically an aluminum heat sink designed for cooling electronic devices such as CPUs, GPUs, or power modules. It belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 10.79 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.11 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features #### A. Fin Geometry This model utilizes **Fine-Pitch** or **Cross-Cut** fin patterns. This design maximizes surface area within a small footprint (35mm), allowing for efficient heat dissipation into the surrounding airflow. #### B. The pushPIN™ Attachment System The "C2" in the part number signifies the specific attachment kit. * **Spring-loaded mechanism:** Provides consistent pressure across the interface, ensuring the Thermal Interface Material (TIM) makes optimal contact with the heat source. * **Brass Components:** The pins are typically made of brass or plastic with a stainless steel spring for durability and high retention force. #### C. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not only provides an aesthetic look but also adds a layer of corrosion resistance and increases thermal emissivity. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Code | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **11H** | Series/Product Family | | **52** | Specific Fin Design / Series ID | | **C2** | Attachment Hardware (Spring/Pin kit type) | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microprocessors on PCBs. * **Telecommunications:** Managing heat in high-speed switches or routers. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.