The **ATS-11H-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs, in tight spaces with high airflow requirements. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Shape** | Square Pin Fin | | **Dimensions** | 36.83 x 36.83 mm | | **Height** | 10 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 26.32 °C/W @ Unducted (Flow) | --- ### 2. Key Component Features #### A. Pin Fin Geometry Unlike traditional straight-fin heat sinks, the **Pin Fin** design provides several advantages for electronic cooling: * **Omnidirectional Airflow:** Air can enter from any direction, making it ideal for systems where the airflow path is not perfectly linear. * **Turbulence Induction:** The pins break up the boundary layer of air, increasing heat transfer efficiency between the aluminum surface and the surrounding air. #### B. pushPIN™ Attachment System The "79-C2" portion of the part number typically refers to the mounting hardware. This system uses: * **Compression Springs:** Provides precise pressure (Force) on the electronic chip to ensure maximum surface contact. * **Plastic/Brass Push Pins:** These snap into pre-drilled holes on the PCB, allowing for a secure and vibration-resistant installation. #### C. Material and Coating * **Blue Anodized Aluminum:** The anodization process provides more than just color; it increases surface emissivity (improving radiative cooling) and provides a layer of electrical insulation and corrosion resistance. --- ### 3. Application Use Cases This specific part is generally found in: 1. **Telecommunications:** Cooling of high-speed network switches. 2. **Embedded Computing:** Protecting industrial PC processors from thermal throttling. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or power modules.